Basic knowledge of PCB board making-FS Technology

Basic knowledge of PCB board making-FS Technology

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Basic knowledge of PCB board making-FS Technology

PCB concept

PCB can be said to be common or uncommon in our lives. It is an important electronic component and a support for electronic components. All electronic products in our lives contain PCB boards. The full name of PCB is Printed Circuit Board, which is called "printed" circuit board because it is made by electronic printing.

The role and function of PCB in various electronic devices
1. Pad: Provide mechanical support for fixing and assembling various electronic components such as integrated circuits.​​
2. Wires: wires used to connect various electronic components, which can help circuit boards achieve wiring and electrical connection (signal transmission) or electrical insulation between components. Provide the required electrical characteristics.
3. Green oil and silk screen: Provide solder mask graphics for automatic assembly, and provide identification characters and graphics for component insertion, inspection, and maintenance.

Development history of PCB technology

Since the advent of PCB, if we look at the development of PCB assembly technology, FS Technology has divided it into three stages

THT-Through Hole Technology Stage

https://www.fs-pcba.com/

(1). Electrical interconnection---signal transmission
Literally, the electrical appliances are directly connected or indirectly connected through transformers and the like
(2). Supporting components---pin size limits the reduction of through hole size
a. Rigidity of the pins
Pin, also called pin. It is the wiring from the internal circuit of the integrated circuit (chip) to the peripheral circuit, and all the pins constitute the interface of this chip. A segment of the end of the lead, which is formed by soldering to form a solder joint with the pad on the printed board. Pin can be divided into bottom, toe, side and other parts.
b. Requirements for automated instrumentation

There are three ways to increase density

(1) Under the regulations (aperture ≥ 0.8mm) to reduce the size of the device hole, why is there a regulation? This is because of the rigidity of the component Pin pins and the limitation of the insertion precision.
(2) Control line width/spacing: 0.3mm—0.2mm—0.15mm—0.1mm
(3) Increase the number of layers of the circuit board: the better the technology, the more layers can be added, FS technology can achieve all the layers, 64 layers - 12 layers - 10 layers - 8 layers - 4 layers - double-sided - single noodle,

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